<Data center>Technology Engineer(3.5D methodology)
Category
Chip Design
Location
HsinChu
Experience
More than 4 Years Work Expe.
Job Description
1. Develop 3.5D methodology from RTL to GDS and Package 2. Coordinate Thermal and PI/SI team to deal with high power design 3. Execute the project at different phases #LI-LYNN
Main Requirements and Qualifications
- 1. Advance process or package design experience
- 2. Better to have 3.5D design experience
- 3. Better to have experiene in large scale and high power design
- 4. Good communication skill in English
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